电迁移过程中焊点的热机械应力与应变( Thermomechanical Stress and Strain in Solder Joints During Electromigration )

JS Zhang HJ Xi YP Wu FS Wu Experimental/ copper current density electrodes electromigration finite element analysis high-temperature effects nickel soldering thermomechanical treatment/ thermomechanical stress solder joints steady-state electromigration test thermomechanical strain current density electrode flow cathode intermetallic compounds anode finite element analysis Joule heating heat dissipation high temperature effects Ni-Cu/ A6630Q Electromigration in solids A8140G Other heat and thermomechanical treatments A8190 Other topics in materials science A8245 Electrochemistry and electrophoresis/ Ni-Cu/int Cu/int Ni/int Cu/el Ni/el

研究了模拟面阵封装焊点发生电迁移时的热机械应力和应变。该封装采用9×9的菊花链焊点,电流密度为0.4×10 4A/cm2,进行电迁移测试。37h后，电子流路径上的第一个焊点在阴极处断裂，前三个焊点在阳极处均呈现典型的金属间化合物堆积。不同的焊点表现出不同的电迁移状态，如稳态和非稳态。有限元分析表明，在稳态电迁移过程中，虽然对称结构使焊点的电流密度和焦耳加热分布均匀，但温度分布不均匀。这是由于热耗散不平衡，进而影响焊点热机械应力和应变的分布。各接头的Ni/Cu层均出现了最大的热机械应力和应变，同时也出现了最大的温度和电流拥挤。Ni/Cu层的应变沿z轴方向显著，但在x-y平面受约束。热机械应力和应变随电迁移的推进而增大；因此，在Ni/Cu层和印刷电路板之间可能发生潜在的分层。

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